Standard aluminum substrates (1.0 mm- 3.0 mm thickness)

High thermal conductivity aluminum substrates (>2.0W/mK)

Copper substrates (1.0 mm- 5.0 mm thickness)

Copper-aluminum composite substrates (balancing cost and performance)

Advanced Processing Technology：

• High-precision CNC milling machines (metal substrate contouring)

• Laser drilling systems (microvia processing)

• Ceramic grinding lines (surface treatment)

• VCP (Vertical Continuous Plating) production lines