Manufacturing Process 1. PTFE Material ProcessingWe use a stepwise temperature ramping curve (peak temperature 280±5°C) and vacuum hot pressing process (pressure 30-50 kg/cm²) to effectively control PTFE phase transitions and ensure lamination quality. 2. Ceramic Substrate ProcessingFor aluminum oxide (Al₂O₃) and aluminum nitride (AlN) substrates, we employ laser direct writing technology to achieve 50μm line width precision, meeting high-density interconnect requirements. 3. Hybrid Pressing TechnologyFor PTFE and FR-4 hybrid designs, we use specialized adhesive sheets such as RO4450B and optimize pressing parameters to address mismatched thermal expansion coefficients (CTE) between different materials. Application: Communication Field，Automotive Electronics Field，Medical Device Sector

Material: Polyimide, Polyester (PET), Polyethylene Naphthalate, Liquid Crystal Polymer Layer: 1-10 layer Min Line/Space:0.075mm Min Hole Size:0.1mm Bend Radius:±0.1mm Base Thickness: 0.05-0.3mmCopper Finished: 1oz-20Oz Manufacturing Process: