Quality Control Management
At Tenpoint, all the boards will go through the most stringent tests. We adopt the testing and inspecting equipments used in the industry. We have strict quality control management. Our Smart production-flow overview and MES station control allow full traceability.


Testing
PCBA testing is a critical quality control process that validates the functionality, reliability, and manufacturability of assembled circuit boards. It involves a series of electrical, functional, and environmental checks to detect defects such as short circuits, open connections, component failures, or firmware issues before mass production.

Our strengths in PCBA Testing——Prevents Costly Failures
- Visual inspection: general quality check.
- FAI: full quality check applied to the first PCB to pass through all stages of production.
- X-ray Inspection: checks for BGAs, QFN and bare circuit boards.
- AOI Testing: checks for solder paste, 0201 components, missing components and polarity.
- 3D AOI Testing: checks for missing and misplaced SMT components in three dimensions.
- 3D SPI Testing: measures the precise volume of solder paste for SMT assembly.
- ICT (In-Circuit Test): Precision Electrical Validation
- Functional test: (Following your test procedures)



Advantages of SPI (Solder Paste Inspection) – Precision Solder Control
SPI is the first line of defense in SMT production, ensuring perfect solder paste deposition before components are placed. By catching printing defects early, it significantly improves first-pass yield and reduces costly post-reflow repairs.
What it checks:
Solder paste volume, height, and coverage
Misprints, bridging, or insufficient deposition
EStencil alignment accuracy
Key Advantages:
✔ Prevents SMT Defects Early – Catches paste issues before reflow, reducing rework.
✔ 3D Measurement Technology – Accurately analyzes paste thickness and shape.
✔ Process Optimization – Provides data to fine-tune stencil design and printing parameters.
✔ High-Speed Inspection – Scans boards in seconds without slowing production.
Best for: High-density PCB assemblies (0201/01005 components, fine-pitch BGAs) High-reliability applications where solder joint quality is critical
X-Ray Inspection – Hidden Defect Detection
What it checks:
X-Ray Inspection – Hidden Defect Detection
Voids, cracks, or misalignment in internal connections
Key Advantages:
✔ See Through Components – Inspects what AOI can’t.
✔ Critical for High-Reliability Products – Medical, automotive, aerospace.
Best for: Complex assemblies with concealed solder joints.


Automated Optical Inspection (AOI) – High-Speed Defect Detection
What it checks:
Tenpoint AOI automatic optical inspection machines are running for both prototype PCB and mass production. We 100% AOI tested PCBAs and scan the device under test for both failure (e.g. missing component) and quality defects.

Key Advantages:
✔ Non-Contact & Fast – Scans boards in seconds.
✔ Consistent & Repeatable – Eliminates human error.
✔ Works with Miniature Components – Detects defects in 01005-sized parts.
Best for: High-speed production lines (SMT assembly).

Environmental & Reliability Testing – Stress Testing for Durability
What it checks:
Temperature cycling (-40°C to +125°C)
Vibration, shock, humidity resistance
Long-term operational stability
Key Advantages:
✔ Simulates Harsh Conditions – Ensures survival in extreme environments.
✔ Reduces Field Failures – Critical for automotive, military, and medical devices.
Best for: Mission-critical applications requiring long-term reliability.
Why Our PCBA Testing Stands Out?
Result: Higher yield, lower failure rates, and dependable end products.
✔ Comprehensive Coverage – From electrical checks to real-world simulation.
✔ Advanced Equipment – High-precision ICT, AOI, X-Ray, and FCT systems.
✔ Industry Compliance – Meets IPC, ISO, and automotive standards.
✔ Faster Time-to-Market – Automated testing reduces delays.

























