Bo1-TGLUT-6C2L Industrial control PCBA

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Item Specifications
Processor Intel® 11th Tiger Lake-UP3 Processor (i3-1125G4/i5-1135G7/i7-1165G7, etc.)
Chipset Intel® SOC
Display Chip Intel® UHD Graphics / Intel® Iris® Xe Graphics
Display Output LVDS/EDP + DP + HDMI
Multi-display Support Three-screen synchronous display
USB 3×USB3.0 Gen2 (10Gbps) + 7×USB2.0
Memory 1×SO-DIMM DDR4 3200MHz, Max 32GB
Audio Onboard ALC269 audio codec; integrated 2.2W@4Ω amplifier
Network Card Intel i219LM + i210AT Gigabit network card (supports vPro)
Storage 1×M.2 M Key (supports SATA/PCIe optional); 1×SATA3.0
Expansion Slot 1×M.2 E Key (supports WiFi/Bluetooth module expansion); 1×M.2 B Key (supports 4G/5G module expansion)
Rear I/O Interface 1×DC_IN port
 
1×LAN2 port (I210)
 
1×LAN1 port (I219)
 
1×USB3.2 + USB2.0 port
 
2×USB3.2 Gen2 (10Gbps) ports
 
1×REC button (supports one-key recovery/backup/CMOS clear)
 
1×DP + HDMI port
 
1×AUDIO combo port
Internal I/O Pin Header 1×F_AUDIO pin header
 
1×Speaker pin header
 
3×F_USB pin headers (expandable to 6×USB2.0 ports)
 
1×F_PANEL pin header
 
1×GPIO pin header
 
1×J_PS2 pin header
 
1×SATA socket
 
1×SATA_PWR pin header
 
1×LVDS pin header
 
1×BKCL pin header
 
1×INVERT pin header
 
6×COM pin headers
 
1×CPU_FAN socket
I/O Chip IT8786E
BIOS AMI BIOS
Power Supply DC 9V–36V wide voltage input
Cooling System Default fan heatsink: ST00000229
Environment Operating: 0–60°C; Storage: -20°C–75°C; 0% – 95% relative humidity, non-condensing
Motherboard Dimensions 146 × 102 mm

 

 

 

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